The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 1997
Filed:
Dec. 12, 1996
Robert Adolph Ackermann, Schenectady, NY (US);
Kenneth Gordon Herd, Niskayuna, NY (US);
Evangelos Trifon Laskaris, Schenectady, NY (US);
John Eric Tkaczyk, Delamson, NY (US);
Kenneth Wilbur Lay, Schenectady, NY (US);
Richard Andrew Ranze, Scotia, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
A superconductive lead assembly for a superconductive device (e.g., magnet) cooled by a cryocooler coldhead having first and second stages. A first ceramic superconductive lead has a first end flexibly, dielectrically, and thermally connected to the first stage and a second end flexibly, dielectrically, and thermally connected to the second stage. A first glass-reinforced-epoxy lead overwrap is in general surrounding contact with and attached to the first superconductive lead. The first lead overwrap has a coefficient of thermal expansion generally equal to that of the first superconductive lead. The lead overwrap protects the lead from moisture damage and from breakage during handling. For added protection against shock and vibration while in the device, the lead assembly is surrounded by a (e.g., polystyrene foam) jacket surrounded by a helically-wound metallic wire surrounded by a glass-reinforced-epoxy jacket overwrap surrounded by a rigid support tube.