The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 1997

Filed:

Dec. 06, 1995
Applicant:
Inventors:

Roger Pierre-Elie Salvin, Weil am Rhein, DE;

Adrian Schulthess, Tentlingen, CH;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J / ; C08F / ; C08F / ; C08L / ;
U.S. Cl.
CPC ...
427510 ; 522 84 ; 522 85 ; 427517 ; 427519 ;
Abstract

There are disclosed photosensitive compositions based on water as solvent and/or dispersant for the components of said compositions, comprising 10-50% by weight of water-soluble and/or water-dispersible solid, crosslinkable film-forming polymers as binder, 4-50% by weight of water-soluble and/or water-dispersible photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, 0.1 to 10% by weight of water-soluble and/or water-dispersible photoinitiator compounds for the photopolymerisable acrylate and/or methacrylate monomers and/or corresponding oligomers, and if the binder contains non-selfcrosslinking polymers, 2.5-40% by weight of water-soluble and/or water-dispersible crosslinking agents for the polymeric binder as thermal hardener, selected from the group consisting of epoxy resins, melamine resins and blocked polyisocyanates. Preferred compositions contain carboxyl group-containing acrylate and methacrylate polymers and copolymers as binder, the carboxyl groups of which composition are reacted with ammonia and/or amines in an amount sufficient to ensure the water-solubility of the polymers and copolymers. The novel compositions are photoimageable and are particularly suitable for use as solder resists.


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