The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 1997
Filed:
Mar. 18, 1996
Chii-Chang Lee, Austin, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method for removing particles (21-24) begins by providing a substrate (10). The substrate (10) contains one or more integrated circuit layers (12) having a top surface (12A). The particles (21-24) are in contact with top surface (12A). A tape (14) comprising an adhesion layer (16) and a carrier film (18) is applied to the surface (12A) such that the adhesion layer (16) is in contact with the particles (21-24). The tape (14) is then removed from the surface (12A) wherein the adhesion layer (16) is able to remove the particles (21-24) from the surface (12A) of the substrate (10). The tape (14) can be applied to a front or active surface of a semiconductor wafer, where the surface either has a topography containing high areas (37) and low areas (39) or has a planarized surface (12A) in order to reduce a total number of particles (21-24) on the surface (12A).