The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 1997
Filed:
Sep. 05, 1996
Kazukuni Takada, Ibaragi, JP;
Hiroshi Uemura, Higashiosaka, JP;
Masahiko Miura, Kawachinagano, JP;
Yoshikazu Shinpo, Nisshin, JP;
Kazuaki Sugimura, Toyota, JP;
Kazuya Nakata, Toyota, JP;
Nippon Gasket Co., Ltd., Osaka-fu, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;
Abstract
In this metal gasket, the beads formed on an intermediate plate prevent a full compression of bead plates and improve the sealability of the gasket. This metal gasket comprises first and second bead plates having main beads extending along the circumferences of holes, and an intermediate plate interposed between the first and second bead plates. The intermediate plate is provided in the regions thereof which are between the holes and the main bead-contacting portions thereof with beads opposed to the first bead plate, and these beads form compensating portions for the first bead plate. The second bead plate is provided with auxiliary beads having projecting portions engageable with the recessed portions of the beads on the intermediate plate. The compensating portions mentioned above prevent a full compression of the beads on the bead plates when the metal gasket is tightened, and offset the irregularity of the opposed surfaces of a cylinder head and a cylinder block. The auxiliary beads improve the sealability of the second bead plate with respect to the compensating portion-carrying intermediate plate.