The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 1997
Filed:
Jun. 07, 1995
Andrew J Moore, Plano, TX (US);
David L Ma, Plano, TX (US);
Robert L Bontz, Plano, TX (US);
Harry B Bonham, Jr, Plano, TX (US);
Alcatel Network Systems, Inc., Richardson, TX (US);
Abstract
A method of increasing the attachment bond strength between a first and second object comprising respective first and second materials is disclosed. Each of the first and second materials has a respective first coefficient of thermal expansion at an assembly temperature, and a second coefficient of thermal expansion at an operational temperature. The method has various steps (FIG. 4). An attachment surface of the first material is configured to be nonplanar (FIGS. 3a, 36, 37). The second material is brought to a contact point with the attachment surface of the first material (FIGS. 3b, 46). The first and second materials are heated at the contact point to the assembly temperature whereby at least one of the materials is caused to flow in response to the heat. Finally, the first and second materials are brought to the operational temperature, wherein at least one of the first and second materials is placed in a compressive state at the contact point due to the relative change in size of at least one of the first and second materials as compared with the change in size of the other of the first and second materials.