The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 1997
Filed:
Nov. 03, 1995
Edward N Mrotek, Grafton, WI (US);
Wen-Hong Kao, Brown Deer, WI (US);
Globe-Union, Inc., Milwaukee, WI (US);
Abstract
A bipolar plate assembly includes a frame member having a center opening therethrough between parallel opposed surfaces, the opening being countersunk on one side of frame the member defining a mounting shoulder, and a bipolar element including a thin lead foil substrate having positive and negative active electrode material disposed on opposite surfaces, the bipolar element being mounted in the opening of the frame member with the marginal edge of the substrate located on the mounting shoulder and secured thereto by an adhesive resin, securing the bipolar element to said frame member, one or more such bipolar plate assemblies being stacked together between first and second terminal electrode assemblies to form a single or multi-element bipolar module having positive and negative terminals, and a plurality of the bipolar modules can be stacked together with their terminals electrically interconnected to form a multi-cell bipolar battery structure. Also disclosed is a method for making a substrate for a bipolar element for use in a bipolar battery, the method including plating a layer of lead onto the polymer fibers or particles using an electroless plating operation to form lead plated polymer particles, plating a thin layer of lead onto the lead plated polymer particles using an electrochemical process, and then forming the substrate by molding the lead coated polymer particles into a desired shape.