The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 1997
Filed:
Mar. 20, 1996
Applicant:
Inventor:
Edwin Fulcher, Palo Alto, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
527778 ; 257700 ; 257691 ; 257698 ;
Abstract
A flip chip substrate includes first and second conductive layers, and a dielectric layer interposed therebetween. Each conductive layer includes a repeating pattern of a group of I/O signal traces such as two I/O signal traces, followed by a wider power or ground trace. The I/O traces on one conductive layer lie atop or below power or ground traces on the other conductive layer. The wider power and ground traces provide shielding on either side of the I/O trace group, as well as above or below.