The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 1997
Filed:
Apr. 28, 1995
Satoshi Furuno, Kyoto, JP;
Kenji Ohtani, Kyoto, JP;
Koichi Inoue, Kyoto, JP;
Koichi Yamasaki, Kyoto, JP;
Keisuke Naganuma, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A single semiconductor chip containing a control portion and a power portion including a power element associated with the control portion and a concave portion formed between the control portion and the power portion is mounted on a die pad so as to separate the control portion and the power portion. The die pad has a convex portion which is received in the concave portion and the semiconductor chip is divided to separate the control portion and the power portion by applying pressure to the chip or by applying laser beams, and the separated semiconductor chip portions are simultaneously bonded to the die pad.