The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 1997
Filed:
Nov. 07, 1995
Applicant:
Inventors:
Takao Miwa, Katsuta, JP;
Masahiro Suzuki, Iwaki, JP;
Akio Takahashi, Hitachiota, JP;
Yoshiaki Okabe, Hitachi, JP;
Yuichi Satsu, Hitachi, JP;
Shin Nishimura, Katsuta, JP;
Assignees:
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
4284735 ; 428209 ; 428901 ; 1741 / ;
Abstract
A thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10.sup.7 to 10.sup.2 dyne/cm.sup.2 during heat curing thereof is suitable for forming an adhesive film used in a thin film wiring board having excellent heat resistance and high reliability.