The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 1997
Filed:
May. 20, 1996
Norio Kawatani, Kanagawa, JP;
Hirokazu Nakayama, Kanagawa, JP;
Sony Corporation, , JP;
Abstract
A thermocompression-bonding unit and a pressure-bonding head unit which are structurally simple and where reliability is high. The pressure-bonding head unit includes a pressure-bonding head; pressure-bonding head holding means for integrally fixing and holding the pressure-bonding head, the pressure-bonding head holding means being formed with a cutout from a first direction side in parallel with the pressure-bonding surface and also being formed with an opening perpendicular both to the first direction and the pressure-bonding surface; first deformation means for deforming the pressure-bonding head holding means so that a cutout inlet of the cutout opens or closes by a desired amount; and second deformation means for deforming the pressure-bonding head holding means so that one opening end or the other opening end of the opening is crushed in a direction parallel to the first direction by a desired amount. Thus the pressure-bonding unit and the pressure-bonding head unit, which are structurally simple and where reliability is high, can be realized.