The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 1997
Filed:
Nov. 30, 1995
Nippon Paint Co., Ltd., Osaka, JP;
Abstract
A method of producing multilayer circuit boardschar comprising repeating a procedure comprising the steps of (1) laminating a photosensitive film composition shaped in a film form onto an insulating material carrying a conductor pattern formed thereon, (2) exposing the laminated photosensitive film composition to light through a negative type photomask, (3) dissolving the domains not irradiated in the above exposure step, (4) heat-curing the domains not dissolved in step (3), (5) forming a copper plating layer on the surface of the photosensitive film composition heat-cured in step (4) by electroless copper plating with or without further electroplating of copper, and (6) forming, on the plated copper layer formed in step (5), a photosensitive etch resist layer and subjecting said layer to light exposure through a photomask having a circuit pattern drawn thereon, developing and etching to thereby form a conductor pattern, said photosensitive film composition for lamination containing at least 50% by weight of a bisphenol-epichlorohydrin type resin containing photosensitive functional groups and heat-curable functional groups.