The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 1997
Filed:
Sep. 19, 1995
Applicant:
Inventor:
Takafumi Imamura, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ; H01L / ;
U.S. Cl.
CPC ...
205123 ; 205124 ; 205157 ; 205159 ; 205164 ; 205165 ; 205166 ; 205167 ; 205189 ; 205186 ; 205187 ; 205188 ; 20419234 ; 4372 / ; 4372 / ; 437 / ; 437 / ; 437230 ; 437246 ;
Abstract
A mask layer is formed on a conductive layer covering not only a central area assigned to integrated circuits but also a vacant peripheral area of a semiconductor wafer, and an electroplating system allows metallic miniature patterns to grow on the conductive layer over the vacant peripheral area as well as extremely small areas of the conductive layer over the central area so as to make current fluctuation negligible.
Imamura, Takafumi. (1997). Process of forming miniature pattern well controlled in thickness on (U.S. Patent No. 5679234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5679234
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile