The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 1997
Filed:
Nov. 14, 1994
Joel W Barlow, Austin, TX (US);
Balasubramanian Badrinarayan, Austin, TX (US);
Joseph J Beaman, Austin, TX (US);
David L Bourell, Austin, TX (US);
Richard H Crawford, Austin, TX (US);
Harris L Marcus, Austin, TX (US);
James R Tobin, Forest Park, OH (US);
Neal K Vail, Ulm/Mahringen, DE;
Board of Regents, Univ. of Texas System, Austin, TX (US);
Abstract
A mold useful for injection molding, comprising: a porous network of metal and oxidized metal and a cured epoxy resin dispersed in the porous network. The mold can be prepared by a process comprising the sequential steps of (a) forming a mixture of a metal powder and a polymer binder; (b) heating the mixture at a temperature in the range from about 100.degree. C. to about 300.degree. C. to remove a majority of the polymer binder from the mixture; (c) heating the mixture resulting from step (b) at a temperature greater than about 300.degree. C. and less than the melting point of the metal in the presence of oxygen to oxidize at least a portion of the metal to form a self-adhering porous network of metal and oxidized metal; (d) contacting the self-adhering porous network with an epoxy resin to fill at least a portion of the porous network with epoxy resin; and (e) curing the body resulting from step (d) to form the mold. The shape of the mold can be performed by selective laser sintering of the mixture.