The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 1997
Filed:
May. 30, 1996
Hideaki Maeta, Kanagawa-ken, JP;
Hiroshi Iwasaki, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Kanagawa-ken, JP;
Abstract
The semiconductor package comprises a board having a wiring circuit including a connecting portion on a first main surface, a semiconductor chip mounted on the first main surface of the board in face-down relation, a resin layer filled into a space formed between a surface of the semiconductor chip and the first main surface of the board, flat type external connecting terminals electrically connected to the semiconductor chip and formed on a second main surface of the board, and a dummy wiring pattern formed at an outer-peripheral edge portion of at least one of the first main surface of the board and an inner wiring layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile