The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 1997

Filed:

Jun. 19, 1996
Applicant:
Inventors:

Kazuyuki Fukuda, Ibaraki-ken, JP;

Makoto Shimaoka, Ushiku, JP;

Satoshi Kaneko, Yokohama, JP;

Kazuhiro Ito, Tokyo, JP;

Shinzo Nishiyama, Kamakura, JP;

Shigefumi Kito, Fujisawa, JP;

Atsushi Takai, Kokubunji, JP;

Atsushi Miura, Fujisawa, JP;

Koichiro Tonehira, Yokoyama, JP;

Assignee:

Hitachi Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ; G02B / ;
U.S. Cl.
CPC ...
385 89 ; 257 98 ;
Abstract

An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device. The terminal portion is formed by extending the terminal portion from at least one of surfaces forming the package case, excluding a surface on which the optical semiconductor array device and the electronic device are mounted and a surface opposite to that surface, and the plurality of pins are mounted in a surface of the terminal portion which crosses at right angles with a surface from which the optical fiber array is taken out, whereby the electronic device is mounted on the external circuit board through the plurality of pins and is electrically connected to the external circuit board.


Find Patent Forward Citations

Loading…