The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 1997

Filed:

Apr. 16, 1996
Applicant:
Inventors:

Claudio S Howard, Hawthorne, CA (US);

Rick L Sturdivant, Placentia, CA (US);

Clifton Quan, Arcadia, CA (US);

John J Wooldridge, Manhattan Beach, CA (US);

Assignee:

Hughes Electronics, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01P / ; H01P / ;
U.S. Cl.
CPC ...
333243 ; 333260 ;
Abstract

A microwave frequency three-wire transmission line provides the capability of solderless interconnections between stacked microwave hybrid and printed wiring board (PWB) assemblies. Three wire-like compressible conductors are embedded in a dielectric support member. Each compressible conductor is realized by densely packing thin wire into an opening in the supporting dielectric. The dielectric preferably has a metal shielding surrounding the outer periphery to suppress higher order modes. A vertical right angle bend transition uses the transmission line to interconnect between grounded coplanar waveguide (GCPW) transmission lines. This orthogonal transition uses button spring contacts, thus creating a reusable solderless vertical interconnection between the two transmission lines. This transition can operate from DC to greater than 15 GHz with good match and low loss, and allows a transition from a GCPW transmission line on a first substrate to another GCPW transmission line on a second substrate stacked above the first substrate.


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