The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 07, 1997

Filed:

Jul. 12, 1995
Applicant:
Inventors:

Deepak Swamy, Austin, TX (US);

David Lunsford, Austin, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257723 ; 257700 ; 257776 ;
Abstract

A hybrid multichip module and method for fabricating same provides a cost-effective interconnection of semiconductor chips combining the advantages of modern MCM-D technology with modern MCM-L technology. In a preferred embodiment, the hybrid multichip module has semiconductor chips mounted to an MCM-D structure and interconnected by an MCM-L structure via solder columns.


Find Patent Forward Citations

Swamy, Deepak. (1997). Hybrid multichip module and methods of fabricating same (U.S. Patent No. 5675183). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5675183

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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