The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 1997
Filed:
Dec. 22, 1995
Hiroaki Kawamoto, Toyota, JP;
Hidekazu Ito, Toyota, JP;
Yuji Nishiyama, Toyota, JP;
Masamitsu Kenmochi, Toyota, JP;
Sadao Kitazawa, Toyota, JP;
Makoto Iwata, Toyota, JP;
Toyota Jidosha Kabushiki Kaisha, Aichi-ken, JP;
Abstract
A process of core molding is disclosed, which permits increasing the positioning accuracy of a base core and a bonded core relative to each other and also avoids handling the first molded base core outside the die to preclude such trouble as breakage of the common die. By the process, a complete core is obtained, which comprises a base core and a bonded core positioned in and bonded to the base core. The base core is molded in a molding space which is defined by engaging a die element and a common die with each other. After removing the die element from the common die while leaving the molded base core in the common die, a different die element is engaged with the common die to define a different molding space for molding a bonded core. The bonded core is bonded to the base core as it is molded.