Package with optical waveguide module mounted therein

Abstract

The present invention relates to a package in which an optical waveguide module is mounted, at least having such structure as to reduce influence of expansion or contraction (thermal stress) of a metal housing, caused with a temperature change of the external environment and applied on junction parts between an optical waveguide substrate and members for fixedly supporting tip portions of input and output optical fibers. This package comprises a cavity for housing the whole of the optical waveguide module as covered with a buffer protection material, and a metal housing having through holes for leading the above optical fibers to the outside. Particularly, the optical fibers and the through holes are bonded and secured with a filler having higher airtightness than the buffer protection material and having a lower tensile modulus than a metal material forming the housing.