The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Dec. 06, 1995
Mark B Penniman, Austin, TX (US);
Peter N Skillman, San Carlos, CA (US);
Tony J Lillios, Palo Alto, CA (US);
Dennis J Boyle, Palo Alto, CA (US);
Dell USA, L.P., Round Rock, TX (US);
Abstract
A thermal transfer circuit is provided for dissipating thermal energy within a portable minicomputer. The thermal transfer circuit is formed during assembly of the personal computer. Specifically, the thermal transfer circuit embodies dual cooling paths for extracting thermal energy from opposing surfaces of an encapsulated integrated circuit. The dual path thermal transfer circuit is formed by drawing the integrated circuit between an upper path heatsink assembly and a lower path heatsink assembly. Thermal connection of heatsink assemblies to corresponding integrated circuit surfaces, either directly or indirectly, allows enhanced dissipation of power-consumptive integrated circuits, such as modern day CPUs. Clamping of the upper and lower heatsink assemblies occurs in equal and opposite force directions normal to opposed integrated circuit surfaces. The normal clamping forces eliminate application of shear force components upon integrated circuit surfaces and the deleterious effects of surface mount lead dislodgment.