The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Aug. 08, 1994
Thomas A Trautt, Santa Barbara, CA (US);
Thomas E Wolverton, Goleta, CA (US);
Santa Barbara Research Center, Goleta, CA (US);
Abstract
A flip-chip assembly and method for reducing the stress in its metal interconnections resulting from thermal mismatch includes a detector that has a radiation sensitive circuit on a substrate that is flip-chip connected to a layer of semiconductor material that is provided with a readout circuit. The substrate has a thermal coefficient of expansion (TCE) greater than the semiconductor layer such that operating the detector over a predetermined temperature range would stress the flip-chip connections. A first compensation layer on the readout chip has a TCE greater than the substrate's, and a second compensation layer on the first layer has a TCE approximately equal to the semiconductor layer's. The materials and thicknesses of the compensation layers are selected such that the TCE of a composite structure that includes the semiconductor and compensation layers is approximately equal to the substrate's TCE to avoid the stress over the predetermined temperature range. In the preferred embodiment, the composite structure is mounted on a platform, which has a TCE approximately equal to that of the substrate.