The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 1997
Filed:
Jan. 25, 1996
Percy Chinoy, Burlington, MA (US);
Joel Goodrich, Westford, MA (US);
The Whitaker Corporation, Wilmington, DE (US);
Abstract
A process to form integrated circuits comprising silver metal circuits. Deposition techniques such as sputtering, not plating, upon substrates to form such silver metal circuits are common. However in the conventional processes to remove the resist and the metal overlaying the resist, these conventional processes are deleterious to the silver metal. Thereby a new process is provided. This new process entails the metal overlaying the resist of the wafer is initially removed by a high pressure force. The resist, in this new process, is then removed by a benign stripper solution having the temperature of the solution raised to the highest temperature without degrading the stripper solution and said circuit is exposed to said stripper solution for one to five minutes.