The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 1997
Filed:
Mar. 21, 1996
Tsuneo Koike, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
The invention provides a semiconductor device in the form of an LSI circuit having a large number of terminals wherein an increase of the number of pad terminals for a power source potential and wherein a ground potential does not increase the inductances of wiring lines to the pad terminals and the terminals are arranged efficiently. The semiconductor device includes a semiconductor chip having a semiconductor substrate on which a first pad arrangement region, a buffer arrangement region and a second pad arrangement region are successively assured in this order toward the outer side around an internal circuit formation region and arranged in parallel to each other. A first power source pad and a first grounding pad for an internal circuit are provided in the first pad arrangement region while a plurality of pads for inputting and/or outputting signals are provided in the second pad region. The pads are bonding connected by respective thin metal lines to external lead terminals provided on a support.