The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 1997

Filed:

Oct. 10, 1995
Applicant:
Inventors:

Shuta Kihara, Hiratsuka, JP;

Shinichi Yonehama, Hiratsuka, JP;

Kiichiro Seki, Hiratsuka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528419 ; 523409 ; 523411 ; 523412 ; 523414 ; 523420 ; 524608 ; 524612 ;
Abstract

An aqueous self-emulsifiable epoxy resin curing agent which is produced by reacting, with each other, an (A) polyamine (meta-xylylenediamine, etc), a (B) epoxy group-containing alkoxypolyethylene polyether compound (methoxypolyethyleneglycol glycidyl ether, etc.) having 500 to 5000 average molecular weight, at least one (C) hydrophobic epoxy compound having at least one epoxy group in the molecule (butyl glycidyl ether, epoxy resin of type bisphenol A or F, etc.) and optionally, a (D) unsaturated compound capable of addition reaction (acrylonitrile, methyl methacrylate, etc.), in a molar quantity of the epoxy group in (B) of 0.001 to 0.1 mol and in a molar quantity of the sum of the epoxy group in (C) and the unsaturated group in (D) of 0.2 to 0.5 mol, each based on 1 mol of a hydrogen atom bonded to a nitrogen atom in (A) which is capable of reacting with an epoxy group or a unsaturated group.


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