The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 1997
Filed:
Nov. 04, 1996
C V Pham, Northville, MI (US);
Brian J Hayden, Royal Oak, MI (US);
Bethany J Walles, Birmingham, MI (US);
Ford Motor Company, Dearborn, MI (US);
Abstract
A process for bonding a flip chip (20), of the type having an active face provided with conductive bumps, to a substrate (22) so that its active face is oriented toward the substrate (22). The flip chip (20) is coupled through a vacuum to the distended end (32) of an ultrasonic horn (30) and then lowered onto the substrate (22) so that the bumps (20b) align with a bonding pattern on the substrate (22). A bias force is applied through the ultrasonic horn (30) to the backside of the flip chip (20), in a direction normal to the substrate (22) so that minimal lateral displacement of the flip chip (20) and the substrate (22) results. The ultrasonic horn (30) is then activated while the bias force is applied such that the ultrasonic energy is isothermally transferred in a direction normal to and across the flip chip (20) to the substrate (22) for creating a diffusion bond therebetween.