The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 1997
Filed:
Sep. 14, 1995
Applicant:
Inventor:
Chikara Yamashita, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257668 ; 257737 ; 257738 ; 257778 ;
Abstract
Disclosed is a semiconductor device which has a semiconductor IC chip, a base film forming a basis of a film carrier tape, through-holes and device holes which open in the base film, a copper-foil wiring formed on the base film, inner leads formed at the inside end of the copper-foil wiring, lands for connecting to outside, apertures formed in the center of the respective lands, cover resist formed on the base film except the lands, sealing resin for protecting the semiconductor IC chip and solder bumps.