The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 1997
Filed:
Dec. 28, 1995
Applicant:
Inventors:
Michinobu Tanioka, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438108 ; 438119 ; 438613 ;
Abstract
A flux is applied to a circuit board on which solder is deposited beforehand. Then, the circuit board is subjected to reflow and then to rinsing. After the rinsing, an IC chip 1 having metal bumps on its electrodes, is mounted to the circuit board. Before the mounting, the chip 1 and circuit board are heated in an inactive gas atmosphere having a low oxygen concentration. At the time of mounting, the solder is melted at a temperature higher than its melting point so as to connect the chip 1 to the circuit board.