The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 1997
Filed:
May. 30, 1996
Applicant:
Inventors:
James R Edman, Circleville, OH (US);
Donald J Coulman, Wilmington, DE (US);
Assignee:
E. I. Du Pont de Nemours and Company, Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05H / ; C23C / ;
U.S. Cl.
CPC ...
205 95 ; 204471 ; 204486 ; 427250 ; 4272557 ; 427296 ; 427301 ; 427306 ; 427316 ; 427322 ; 427404 ; 427539 ; 427573 ; 427536 ; 205158 ; 205165 ; 205186 ;
Abstract
A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.