The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 1997

Filed:

Jun. 05, 1995
Applicant:
Inventors:

Takeshi Tokairin, Tokyo, JP;

Tatsuyuki Ishijima, Tokyo, JP;

Assignee:

Seikosha Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
414225 ; 414753 ; 414783 ; 198379 ;
Abstract

A device for positioning and clamping a board includes a plurality of clamping devices for clamping an edge portion of the board. Each clamping device includes positioning members for positioning the board with respect thereto, and a dragging device disposed between the clamping devices for dragging the board into contact with the positioning members. The dragging device is provided with a board clamping portion including a lower claw and an upper claw having rotating disks rotatably installed thereon for swivably clamping the board, and a reciprocating mechanism connected with the board clamping portion for reciprocating the board clamping portion. A board is first clamped by the dragging device and is dragged into contact with the positioning members of the clamping devices. The board is then pivoted and its attitude is straightened by further movement against the positioning members of the clamping devices, then the board is firmly clamped by the clamping devices and the clamping by the dragging device is released. Finally, the clamping devices are moved and a standard location is determined at a portion where the board traverses a sensor, thereby improving the space efficiency and avoiding lowering of positioning accuracy due to scattering of cutting chips.


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