The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 1997

Filed:

Mar. 15, 1995
Applicant:
Inventors:

Wilhelm Tamm, Aidlingen, DE;

Walter Olbrich, Magstadt, DE;

Siegfrid Dippon, Gechingen, DE;

Michael Weitmann, Holzgerlingen, DE;

Si-Ty Lam, Pleasanton, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ; H05K / ;
U.S. Cl.
CPC ...
29847 ; 29833 ; 29852 ; 427 97 ;
Abstract

A printed circuit board is made by producing recesses and/or holes in an electric insulating substrate by laser ablation. The recesses correspond to a desired pattern of conductor structures and/or holes. Conductive material is then deposited on substantially an entire face of the substrate. Conductive material is then removed from the substrate outside the desired pattern of conductor structures and/or holes.


Find Patent Forward Citations

Tamm, Wilhelm. (1997). Method of manufacturing printed circuit boards (U.S. Patent No. 5666722). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5666722

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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