The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 1997
Filed:
May. 18, 1995
Applicant:
Inventor:
Katsuyuki Kato, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
438642 ; 438648 ; 438649 ; 438669 ; 438625 ;
Abstract
A method of manufacturing semiconductor interconnection includes the steps of providing a bottom conductive layer having an auxiliary conductive layer applied on top of the bottom conductive layer. The auxiliary conductive layer is patterned and subsequently a further conductive layer is applied over the patterned auxiliary conductive layer. A mask is then applied over the further conductive layer to form a pillar connection which provides a reliable connection in a semiconductor device.