The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 1997
Filed:
May. 30, 1995
Kazumi Yoshioka, Yawata, JP;
Tetsuya Akiyama, Habikino, JP;
Takeo Ohta, Nara, JP;
Hidemi Isomura, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
On one surface of a disk substrate, a first dielectric layer, a thin recording layer, a second dielectric layer and a reflecting layer are cumulatively formed. The second dielectric layer is thinner than the first dielectric layer and is 35-70 nm thick. The reflecting layer is 70-120 nm thick. The total thickness of the four layers is 250-430 nm. The compressire stress of the layers is offset by tensile stress generated by an overcoat resin protective layer, formed on the reflecting layer. A method of using the optical recording medium applies the MCAV (Modified Constant Angular Velocity) recording method which records information by changing recording frequencies in accordance with linear velocity. The linear velocity is 5-12 m/s. A ratio of an inner circumference recording pulse width to an outer circumference recording pulse width is 1.2 or more.