The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 1997

Filed:

Jun. 07, 1995
Applicant:
Inventors:

Hsien-Kun Chu, Wethersfield, CT (US);

Robert P Cross, Rocky Hill, CT (US);

Patrick J Courtney, Newington, CT (US);

David I Crossan, Hebron, CT (US);

Assignee:

Loctite Corporation, Hartford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ;
U.S. Cl.
CPC ...
528 14 ; 528 17 ; 528 18 ; 528 12 ; 528 32 ; 522 99 ; 522 40 ; 522 44 ; 522 46 ; 524863 ; 524866 ;
Abstract

The present invention relates to a process for preparing an alkoxy silyl-terminated material, which has at least two alkoxy groups on both terminal ends, said process comprising reacting in the presence of a catalytically effective amount of an organo-lithium reagent an alkoxysilyl-terminated first reactant with a second reactant having both ends of its chain terminating in a silanol. The alkoxy silyl-terminated material may have a variety of polymer backbone types such as silicone, polyurethane, polyamide and the like. These materials are intended to cure by either moisture or photo cure or by dual moisture and photo cure mechanisms. The alkoxy silyl-terminated material is preferably an organopoly-siloxane having at least two alkoxy groups at both terminal ends. The resultant alkoxy-terminated organopolysiloxanes are substantially stable materials as measured by preservation and maintenance of viscosity values (cps) over time and exhibit a higher crosslinking density when cured due to a higher degree of endcapping as compared to the prior art.


Find Patent Forward Citations

Loading…