The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 1997
Filed:
Dec. 13, 1995
Applicant:
Inventors:
Jun-Ichi Sasaki, Tokyo, JP;
Masataka Itoh, Tokyo, JP;
Hiroshi Honmou, Tokyo, JP;
Toshitaka Torikai, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
385 49 ; 385 89 ; 385 88 ; 385147 ; 359900 ;
Abstract
An optical module has an optical wave-guide structure formed on a silicon substrate and a laser diode array solder bonded to first pads patterned on the silicon substrate in a self-aligned manner by virtue of surface tension of solder during a reflow stage, and the first pads are shaped into a rectangular parallelopiped configuration so as to make a ratio of a solder bump height to a pad width large without decrease of the volume of the solder bump, thereby generating large surface tension.