Tape application platform and processes therefor

Abstract

A platform serves to carry an integrated circuit chip (20) for handling and alignment through wire bonding or TAB operations, provides interconnections, and supports the IC chip in its use environment. The platform base (10) has a flat portion which may have a slot (30) passing through it and extending approximately the length of an IC chip (which has wire-bond pads (140), some of which may be near a chip axis). The IC chip is mounted to the platform base with tape (50), which provides at least one adhesive surface. The tape may be a cast or contained adhesive or epoxy with or without a backing layer, or it may be a thermoplastic or thermo-setting plastic. TAB or wire-bond pads are aligned with respect to the platform slot. If the chip has more than one row of wire-bond pads, the platform may have more than one slot. If more than one chip is mounted to the platform, the platform's base may have one or more slots (30, 40) per chip. Circuitry (90) may be printed on one or both sides of the platform base. The circuitry is preferably made to have a relatively high sheet resistivity to damp ringing of noise signals. Wire bonds are made through the slot (30), connecting pads on the IC chip with printed circuitry. The platform base may have an electrically conductive area (90) on one or both sides to provide a shield, ground plane and/or power bus, connected by wire bonds to pads of the IC chip and to a higher level of circuitry. Conductive bus elements (60 and 70) having continuous wire-bond areas may be provided, attached with tape (80). The platform may have terminals (100) for interconnection with a higher level of circuitry and/or narrow leads (1220) extending over the IC chip. Components (110, 120) other than the integrated circuit chip may also be carried on the tape application platform.