The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 1997

Filed:

Aug. 28, 1995
Applicant:
Inventors:

Treliant Fang, Chandler, AZ (US);

Lih-Tyng Hwang, Phoenix, AZ (US);

William M Williams, Gilbert, AZ (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
438 17 ; 438119 ; 324757 ; 156325 ;
Abstract

A process for using removable Z-axis anisotropically conductive adhesive material (21) which includes water, a matrix resin (23), and conductive spheres (22). The material (21) is suitable for providing temporary contact between electronic devices. In one embodiment, the material (21) is used to temporarily bond a semiconductor wafer (11) to a probe substrate (12) for wafer-level burn-in.


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