The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 26, 1997
Filed:
Dec. 08, 1994
Raymond S Wong, San Ramon, CA (US);
Dexter Corporation, Pittsburg, CT (US);
Abstract
An orientable in situ expandable layer comprising a) a blend of incompatible, in situ-expandable thermoplastic particles and a thermosettable matrix resin for the in situ-expandable thermoplastic particles which blend has the capacity of expansion in height, width and length directions and b) other insoluble and matrix-resin incompatible solid particles uniformly incorporating throughout the resin matrix, which other insoluble and matrix-resin incompatible solid particles have (i) an aspect ratio of length/width greater than 1, that defines a longitudinal axis (length) of the particles which longitudinal axis is not greater than about one inch (2.54 cm.), and (ii) thermal stability at the temperature of expansion of the resin and insolubility in the resin, and (iii) an orientation in the thermosettable resin of their length in one or two directions. Moldable compositions and methods of making the compositions and molded article from the compositions are disclosed.