The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1997
Filed:
Feb. 16, 1996
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device in which molding resin is not adhered on test pads of leads extending from a junction of an upper package half-body and a lower package half-body. The semiconductor device can effectively release heat generated by a semiconductor chip molded in a package of the semiconductor device. The semiconductor device includes a semiconductor chip having a plurality of leads connected thereto. A package of the semiconductor device is formed by means of molding. The package is constructed of a first package portion and a second package portion integrally formed into one package. The first package portion has a horizontal section smaller than that of the second package portion so that a portion of each of the leads extends from a part of the package between the first package portion and the second package portion and is exposed on a surface of the second package portion. The semiconductor chip is positioned within the second package portion. A supporting member is provided in the second package portion for supporting the portion of each of the leads and is located inside the second package portion so as to prevent deformation of the leads during molding of the package.