The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1997
Filed:
Jun. 24, 1996
John James Hudak, Columbus, MD (US);
David Jerome Mountain, Baltimore, MD (US);
Other;
Abstract
A method of making a multi-chip module by thinning individual integrated circuit die or an integrated circuit wafer containing multiple integrated circuits; bonding thinned dice or a thinned wafer to a mylar, polyimide, semiconductor, or ceramic substrate; depositing at least one interconnect material over the wafer, where the first interconnect layer is deposited directly over the wafer; depositing a dielectric layer over each of the interconnect layers; opening vias in the dielectric layers in order to interconnect the dice and multi-chip module as required; and removing the substrate to form a thin, conformal, and high-yielding multi-chip module.