The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1997
Filed:
Jul. 26, 1996
Applicant:
Inventor:
Naoshi Makiguchi, Akasakadai, JP;
Assignee:
Sintokogio, Ltd., , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425504 ; 156212 ; 156510 ; 156530 ; 264163 ; 425289 ; 425388 ; 425510 ;
Abstract
A mold assembly is disclosed that has an electrically heatable body, that glues and trims a film, and that minimizes the heat loss of the heatable body. The mold assembly includes a receiving mold (2) formed on the upper part of a frame (1), a non-current-conductive and heat-resistive material (11) disposed at the periphery of the receiving mold and having vertical throughbores (14), an electrically heatable body (5) extending along the throughbores, and metal holders (12) disposed in the throughbores (14) to hold the electrically heatable body (5) in a non-contact relation with the heat resistive material (11) at least at the positions where the holders are.