The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1997
Filed:
Aug. 02, 1995
Applicant:
Inventors:
Akimasa Kaneishi, Hiratsuka, JP;
Sinji Kiboshi, Hiratsuka, JP;
Isamu Mio, Hiratsuka, JP;
Michiyasu Fukui, Osaka, JP;
Assignees:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Miyagawa Kasei Industry Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264572 ; 425130 ;
Abstract
An injection-molding method using an injection molding machine having a mold apparatus comprising
Kaneishi, Akimasa. (1997). Mold apparatus and injection molding method for producing (U.S. Patent No. 5656234). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5656234
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile