The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 12, 1997
Filed:
Apr. 19, 1995
Brad J Anderson, Cameron Park, CA (US);
William A Hayes, Wilton, CA (US);
Aerojet-General Corporation, Sacramento, CA (US);
Abstract
Platelet assemblies are formed from bondable platelets, such as diffusion-bondable, brazable, or adhesive-bondable platelets, with void regions in the platelets to form channels or open spaces in the finished platelet assembly. To improve the response of the platelet assembly to pressure bonding as well as to post-bonding fabrication processes such as forming, machining and welding, the void regions are filled with a sacrificial material which transmits the load of the applied pressure in the same manner as the remainder of the platelet, and yet which is removable from the finished platelet assembly by either thermal or chemical liquefaction after all potentially damaging fabrication procedures have been performed on the platelet assembly.