The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 1997

Filed:

Dec. 08, 1995
Applicant:
Inventors:

Masashi Ohi, Tokyo, JP;

Hiromichi Taniguchi, Tokyo, JP;

Atushi Kobayashi, Tokyo, JP;

Assignee:

NEC Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G / ; H01G / ;
U.S. Cl.
CPC ...
361540 ; 361524 ; 361525 ;
Abstract

A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed. After removing the electrode lead member, an anode outer electrode layer is formed on the insulating resin impregnated portion, and a cathode outer electrode layer which electrically connects to the cathode layer is formed on the end face of the anode member opposing to the anode outer electrode layer.


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