The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 1997

Filed:

Jun. 07, 1995
Applicant:
Inventor:

Ryo Yasoshima, Tokyo, JP;

Assignee:

Tsukineko, Inc., Redmond, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41K / ;
U.S. Cl.
CPC ...
118 46 ; 118264 ; 118269 ; 118270 ; 101171 ; 101327 ; 101333 ; 101334 ; 33622 ;
Abstract

An expandable stamp pad comprising a plurality of ink pads arranged in a line and suitable for use with a multitude of different aqueous dye-based inks, and methods of using the same. Typically, the line is straight, although, if desired, the line may be curved. The plurality of ink pads are retained on an extension member that permits adjacent ink pads to contact one another when the extension member is retracted, (e.g., in use) while maintaining the plurality of ink pads in separation when the extension member is extended (e.g., in storage). Also, a multi-color stamp pad suitable for use with aqueous dye-based inks wherein a plurality of ink pads each impregnated with a different ink have disposed therebetween a thin, aqueous-impermeable film, such as a thin plastic film. Preferably, the stamp pad comprises more than two ink pads, further preferably five or more ink pads.


Find Patent Forward Citations

Yasoshima, Ryo. (1997). Method of stamping expandable stamp pad (U.S. Patent No. 5653804). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5653804

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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