The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 1997
Filed:
Jul. 05, 1996
David Charles Deleeuw, Midland, MI (US);
Neal Roger Langley, Midland, MI (US);
Dow Corning Corporation, Midland, MI (US);
Abstract
The yield stress of rheologically plastic fluids such as coatings, sealants, and personal care lotions, determines their tendency to flow at low gravitational stress. Yield Stress is the apparent threshold stress above which flow is observed on an arbitrary time scale. An on-line technique to monitor yield stress during processing was developed, and can be used in controlling the slump or non-slump behavior of such products. A residual stress, after a flow excursion returns to zero shear rate, is related to yield stress. This residual stress can be used for process monitoring. It is measured from the residual pressure or torque after a controlled strain rheometer reaches zero strain rate.