The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 1997

Filed:

Jun. 05, 1995
Applicant:
Inventors:

Satoshi Hirano, Hitachi, JP;

Yutaka Fukui, Hitachi, JP;

Hideyo Kodama, Katsuta, JP;

Toshiyuki Kajiwara, Tokyo, JP;

Yasutsugu Yoshimura, Hitachi, JP;

Tomoaki Kimura, Hitachi, JP;

Kenji Horii, Hitachi, JP;

Tadashi Nishino, Hitachi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D / ;
U.S. Cl.
CPC ...
164459 ; 1641547 ; 164416 ; 164418 ;
Abstract

The apparatus is formed by confronting wide side mold walls and confronting narrow side mold walls, The narrow side mold walls are composed of an electrically conductive refractory material and are directly heated. Each of the narrow side mold walls include an upper squeezed portion and a lower parallel portion, The upper squeezed portion has a surface in contact with the molten metal which converges in width along a casting direction. The lower parallel portion has surface in contact with the molten metal which is substantially uniform in width.


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