The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 1997
Filed:
Nov. 22, 1995
Ronald Peter Kochanski, Arlington Heights, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A surface mountable component (110) is urged toward a substrate (102) during a bonding operation. The apparatus consists of a thermally activated clamping device (TACD) (300) having alloys with differing relative deflection-temperature characteristics. When exposed to elevated temperatures, the thermally activated clamping device (300) deforms a predetermined amount depending upon the heat-energy applied to the thermally activated clamping device (300). This allows for a mounting bracket that applies a force on a component (110) in proportion to an amount of heat-energy applied to the mounting bracket. In addition, the thermally activated clamping device (300) is coupled locally to the substrate in an area surrounding the component which eliminates the need for long, fragile mounting brackets. The method consists of utilizing the relative deflection-temperature characteristics of metals to clamp a component (110) during a bonding operation.