The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 1997
Filed:
Oct. 23, 1996
Tomohiko Yamamoto, Kanagawa-ken, JP;
Shoichi Tanimata, Kanagawa-ken, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A hybrid IC device has an insulation substrate 1. Circuit patterns 2 made of a thick copper film are formed on the substrate 1. The circuit patterns 2 include terminal patterns 8. Through-holes 7 electrically connect the terminal patterns 8 to terminal patterns 81 formed on the bottom surface of the substrate 1. Active elements such as transistors and ICs and passive elements such as resistors and capacitors are mounted on the top surface of the substrate 1 and are electrically connected to the circuit patterns 2. A conductive pattern 6 made of a thick copper film or a thick silver-platinum film is formed on the bottom surface of the substrate 1. The conductive pattern 6 is used for grounding and heat radiation. The conductive pattern 6 is electrically connected to the active and passive elements via through-holes. The through-holes are usually formed Just under the active and passive elements. If the elements are transistors, the through-holes for the transistor are formed outside the orthogonal projection of the transistors on the substrate.