The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 1997
Filed:
Jan. 23, 1996
Shinichi Chikaki, Tokyo, JP;
NEC Corporation, , JP;
Abstract
In a wafer polishing device, a resin sheet polishes a wafer with a polishing liquid fed thereto, while sliding on the wafer. Tension mechanisms apply an adequate degree of tension to the sheet in order to provide it with a desired elastic strength. Even if the wafer has a deformation or roughness ascribable to its uneven thickness, the sheet corrects some degree of deformation and then polishes the wafer, following the corrected configuration of the wafer. At this instant, the pressure acting on the wafer is even over the entire surface of the wafer. The sheet is formed of a material which is hydrophilic and resistant to fluoric acid. With this construction, the device corrects irregularities ascribable to the formation of a device from the wafer even if the wafer itself has any deformation or irregularity.