The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 15, 1997
Filed:
Jan. 19, 1996
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device includes a semiconductor chip having electrode pads on the semiconductor chip, the electrode pads including a predetermined electrode. A plurality of leads are electrically connected to the electrode pads on the semiconductor chip, the leads including a predetermined lead electrically connected to the predetermined electrode. A resin package encloses the semiconductor chip and partially encloses the leads. A bypass lead portion electrically connects one of the leads, not adjacent to the predetermined electrode, to a location adjacent to the predetermined electrode, the bypass lead portion being enclosed in the resin package. A supporting lead supports the bypass lead portion such that the supporting lead prevents a deformation of the bypass lead portion, the supporting lead being enclosed in the resin package.